|X-ray Tube||160 kV / 200 ㎂|
|Table Size||400 X 400 mm|
|Detector||5 inch FPXD|
|CT Scan Method||Unable CT|
|Objects||BGA, Chip, QFN, QFP, Battery|
|Foot print||1,020 x 1,350 x 1,720 mm|
In-Line 2D X-ray Inspection Machine
Automatically In-Line inspect Solder Joint defects of PCBA, and other defects on Hidden Components.
Able to be customized regarding Application by users setting ROIs.
Especially, area type image scanning can gain high resolution results fast.
- High speed 2D In-Line Inspection System (0.5 sec/FOV)
- BGA, Chip, QFN, QFP, Battery
- Short, Bridging, Manhattan, Miss align, etc
SMT Chip BGA (Short, Miss align, Missing)