|X-ray Tube||130 kV / 200 µA|
|Min. Resolution||6~15 µm|
|Detector||8 M Pixel FPD|
|Chip Size||Min : 8 x 6 (mm) , Max : 20 x 20 (mm)|
|Defects||Non-wet, Open, Short, Big / Small ball|
|Dimension||2,300(W) x 2,400(D) x 2,120(H)mm / 4,800kg|
3D CT X-ray Inspection System for POP(Package on Package)
3D automatic X-ray inspection system for POP(Package on Package), having the latest semiconductor layering technology.
From loading to judgement of NG/Good & sorting out of POP products would be made automatically.
And results would be saved into basic data based to help SPC. It has the fastest inspection speed of 2.5sec/FOV.
- 3D In-Line inspection system for POP packages
- Good-NG analysis of interconnection using 3D CT
- Detection speed : Max. 5 sec/unit
Cu pillar Bump non wet
POP Bump Short