X-eye SF160 Series
Detail View →
| X-ray Tube | 130 kV / 200 µA |
|---|---|
| Min. Resolution | 6~15 µm |
| Detector | 8 M Pixel FPD |
| Chip Size | Min : 8 x 6 (mm) , Max : 20 x 20 (mm) |
| Defects | Non-wet, Open, Short, Big / Small ball |
| Dimension | 2,300(W) x 2,400(D) x 2,120(H)mm / 4,800kg |
3D CT X-ray Inspection System for POP(Package on Package)
3D automatic X-ray inspection system for POP(Package on Package), having the latest semiconductor layering technology.
From loading to judgement of NG/Good & sorting out of POP products would be made automatically.
And results would be saved into basic data based to help SPC. It has the fastest inspection speed of 2.5sec/FOV.
- 3D In-Line inspection system for POP packages
- Good-NG analysis of interconnection using 3D CT
- Detection speed : Max. 5 sec/unit
Cu pillar Bump non wet
POP Bump Short
Applications
