• X-eye 62000
  • X-eye 62002
  • X-eye 62003
  • X-eye 62000
  • X-eye 62002
  • X-eye 62003

X-eye 6200

X-ray Tube

160 kV / 500 µA (option 130 KV / 300 µA)

Min. Resolution

0.8 ~ 15 µm

Table Size

Min : 50 x 50 (mm), Max : 330 x 250 (mm)

Detector

1.6 M Pixel FPD

Defects

BGA : Short, Bridging, Void

Chip : Manhattan, Miss align, Short

Wire Bonding : Sweep, Broken, Double Bonding, Missing

Objects

BGA, Chip, QFN, QFP, Wire Bonding
Dimension 1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg

In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.
Performing X-ray inspection in various production site, integrated with other manufacturing equipements.

  • High speed 2D In Line inspection System (0.5 sec/FOV)
  • Hybrid Tube with long life span for In-line purpose (10,000hrs/Filament)
  • WAXI : Wire Automatic X-ray Inspection Detection of wire defects possible (Shorts, sweep, mssing, etc)

SMT Chip BGA / 2D Inspection

Wire Bonding / 2D Inspection
 
Applications