3D CT X-ray Inspection System for POP(Package on Package)
3D automatic X-ray inspection system for POP(Package on Package), having the latest semiconductor layering technology.
From loading to judgement of NG/Good & sorting out of POP products would be made automatically.
And results would be saved into basic data based to help SPC. It has the fastest inspection speed of 2.5sec/FOV.
- 3D In-Line inspection system for POP packages
- Good-NG analysis of interconnection using 3D CT
- Detection speed : Max. 5 sec/unit
Cu pillar Bump non wet
POP Bump Short