X-eye SF160 Series
Detail View →
| X-ray Tube | 120 kV / 200 µA |
|---|---|
| Min. Resolution | 0.2㎛ |
| Table Size | 12inch wafer |
| Detector | 6 inch FPXD |
| CT Scan Method | Oblique CT / Cone beam CT |
| Foot print | 2,380 x 1,450 x 2,120 mm Control Box : 600 x 1,250 x 1,030 mm |
| Weight | 7,000kg |
Nano-focus X-ray Inspection System
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
- Non-destructive analysis system for Wafer Level Packaging
- High resolution image with Dual Type CTs
- TSV, Micro Bump, Pattern
Wafer Bump Void
Wafer TSV Void
Applications
