• X-eye NF1200
  • X-eye NF1202
  • X-eye NF1203
  • X-eye NF1200
  • X-eye NF1202
  • X-eye NF1203

X-eye NF120

 X-ray Tube 120 kV / 200 µA
 Min. Resolution 0.2㎛
 Table Size 12inch wafer
 Detector 6 inch FPXD
 CT Scan  Method Oblique CT / Cone beam CT
 Foot print 2,380 x 1,450 x 2,120 mm Control Box : 600 x 1,250 x 1,030 mm
 Weight 7,000kg

Nano-focus X-ray Inspection System
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.

  • Non-destructive analysis system for Wafer Level Packaging
  • High resolution image with Dual Type CTs
  • TSV, Micro Bump, Pattern

Wafer Bump Void

Wafer TSV Void

Applications