Nano-focus X-ray Inspection System
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
- Non-destructive analysis system for Wafer Level Packaging
- High resolution image with Dual Type CTs
- TSV, Micro Bump, Pattern
Wafer Bump Void
Wafer TSV Void