JAP-1KH
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Safe and Effective Plasma
Plasma uses low power and gas temperature, is safe to touch, safe to use on sensitive electronic components, and creates an optimal fit condition by affecting surface cleaning and activation.
Optimal Adhesion
To prevent internal short circuit, the bonding medium between electronic components must have an insulating effect. Plasma microcleaning and activation ensure a precise insulating bond with optimum adhesive properties.
Completely Sealed
Plasma microcleaning significantly increases the efficiency of the seal, preventing moisture and other corrosive media from entering the crevices of electronic components. When components require a higher level of protection, anti-corrosion plasma coatings are applied.
Application Evaluation Available
Product Specifications
| FACLITY | Power | 220V, 2kW, 10A, 60Hz/50Hz |
| Air Supply | 90PSI (0.6MPa) | |
| System Dimension (W x D x H) | 800 x 1250 x 1450 | |
| System Weight | 400kg | |
| Standard Complicnce | KS Standards | |
| MOTION | Positioning Accuracy | Y± 20μm Z± 10μm |
| Y, Z Repeatability | Y± 10μm Z± 10μm | |
| Y Max Speed | 500mm/s | |
| Acceleration | 0.5G | |
| Drive System | Step Motor | |
| BOARD | Conveyor Type | Belt |
| Tool Payload Capacity | 3kg | |
| Minimum Board/Carrier Width | 40mm | |
| Maximum Board/Carrier Width | 350mm | |
| Minimum Board/Carrier Length | 50mm | |
| Maximum Board/Carrier Length | 350mm | |
| Operating System | Windows 7 | |
| Board Thockness Range | 0.5~6mm | |
| Communication Protocol | SMEMA | |
| PLASMA HEAD | Plasma Area(D x W) | 350 - 350mm |
Plasma Specifications
| FACLITY | Power | 1000W at 50kHz |
| Primary Gas | Air or Argon | |
| Process Gases | O2, N2, H2 | |
| Operating Pressure Range | 30 - 90psg(0.2 - 0.6Mpa) |